3D Bioplotter Research Papers

Displaying all papers about Thermal Conductivity (3 results)

Thermoelectric transport in bulk Ni fabricated via particle-based ink extrusion additive manufacturing

Early Career Materials Researcher Research Letter 2022 Volume 12, Pages 609–615

Bulk Ni samples were additively manufactured using particle-based ink extrusion. Three samples were characterized for thermoelectric transport properties including electrical resistivity, thermal conductivity, Seebeck coefficient, and thermoelectric figure of merit. Sample-to-sample deviations in transport were small but observable; these were attributed to stochastic porosity from the manufacturing method. Transport results were compared to previously published results in both porous and dense Ni, indicating that the salient features in the traditionally manufactured Ni samples are maintained in their additively manufactured counterparts. These results are offered as evidence of the feasibility of using particle-based ink extrusion additive manufacturing for thermoelectric applications.

Anisotropic, Strong, and Thermally Insulating 3D-Printed Nanocellulose–PNIPAAM Aerogels

Small Structures 2023 Article 2300073

Cellulose is a promising candidate for the fabrication of superinsulating materials, which would be of great interest for thermal management applications as well as for the scientific community. Until now, the production of strong cellulose-based aerogels has been dominated by traditional manufacturing processes, which have limited the possibilities to achieve the structural control and mechanical properties seen in natural materials such as wood. In this work, we show a simple but versatile method to fabricate cellulose aerogels in intricate geometries. We take advantage of the 3D printing technique direct ink writing to control both the shape and the thermal-mechanical properties…

High thermal conductive epoxy based composites fabricated by multi-material direct ink writing

Composites Part A: Applied Science and Manufacturing 2020 Volume 129, Article 105684

Thermal management is of importance to microelectronic industry. Owing to both excellent thermal conduction and electrical insulation, hexagonal boron nitride (BN) platelets are the widely-used thermal conductive fillers in polymers. Adding high content of BN can endow polymers high thermal conductivity, but in most cases, destroy the flexibility, failure strength as well as processability of the polymers significantly. Here, we report a multi-material 3D printing technique to prepare high thermal conductive epoxy based composites, by which BN platelets were assembled together in heat-conducting phase to form the dense, continuous thermal pathway. The BN platelets show excellent alignment along printing direction…